The Royal Society
Browse

Supplementary Material from Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth

Download (676.97 kB)
dataset
posted on 2024-09-06, 17:01 authored by Yun-Fong Lee, Yu-Chen Huang, Jui-Sheng Chang, Ting-Yi Cheng, Po-Yu Chen, Wei-Chieh Huang, Mei-Hsin Lo, Kuan-Lin Fu, Tse-Lin Lai, Po-Kai Chang, Zhong-Yen Yu, Cheng-Yi Liu
electronic supplementary material (ESM)-dataset.xlsx

History

Usage metrics

    Royal Society Open Science

    Categories

    Keywords

    Materials scienceElectrical engineeringNanotechnology

    Licence

    CC BY 4.0

    Exports

    RefWorks
    BibTeX
    Ref. manager
    Endnote
    DataCite
    NLM
    DC